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W24512A 64K x 8 HIGH SPEED CMOS STATIC RAM
GENERAL DESCRIPTION
The W24512A is a high speed, low power CMOS static RAM organized as 65536 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.
FEATURES
* *
High speed access time: 15/20/25/35 nS (max.) Low power consumption: - Active: 500 mW (typ.) Single +5V power supply Fully static operation
* * *
All inputs and outputs directly TTL compatible Three-state outputs Available packages: 32-pin 300 mil SOJ, skinny DIP, 450 mil SOP, and standard type one TSOP
* *
PIN CONFIGURATIONS
BLOCK DIAGRAM
V DD
NC NC A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
V DD A15 CS2 WE A13 A8 A9 A11 OE A1 0 CS1 I/O8 I/O7 I/O6 I/O5 I/O4
V SS A0 . . A15
DECODER
CORE C O RE ARRAY
CS2 CS1 OE WE
CONTROL
DATA I/O
I/O1 . . I/O8
PIN DESCRIPTION
SYMBOL A0-A15 I/O1-I/O8 CS1, CS2 WE OE VDD VSS NC DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Inputs Write Enable Input Output Enable Input Power Supply Ground No Connection
A11 A9 A8 A13 WE CS2 A15 VDD NC NC A14 A12 A7 A6 A5 A4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32-pin TSOP
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
OE A10 CS1 I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3
-1-
Publication Release Date: March 1999 Revision A7
W24512A
TRUTH TABLE
CS1 H X L L L CS2 X L H H H OE X X H L X WE X X H H L MODE Not Selected Not Selected Output Disable Read Write I/O1-I/O8 High Z High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 ISB, ISB1 IDD IDD IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
Operating Characteristics
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current
SYM. VIL VIH ILI ILO
TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD CS1 = VIH or CS2 = VIL or OE = VIH or WE = VIL IOL = +8.0 mA IOH = -4.0 mA 15 CS1 = VIL, CS2 = VIH I/O = 0 mA, Cycle = min. Duty = 100% 20 25 35
MIN. -0.5 +2.2 -10 -10
TYP. -
MAX. +0.8 VDD +0.5 +10 +10
UNIT V V A A
VOL VOH IDD
2.4 -
-
0.4 200 160 160 140 30 10
V V mA
Standby Power Supply Current
ISB ISB1
CS1 = VIH or CS2 = VIL Cycle = min., Duty = 100% CS1 VDD -0.2V or CS2 0.2V
-
-
mA mA
Note: Typical characteristics are at VDD = 5V, TA = 25 C.
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W24512A
CAPACITANCE
(VDD = 5V, TA = 25 C, f = 1 MHz)
PARAMETER Input Capacitance Input/Output Capacitance
SYM. CIN CI/O
CONDITIONS VIN = 0V VOUT = 0V
MAX. 8 10
UNIT pF pF
Note: These parameters are sampled but not 100% tested.
THERMAL RESISTANCE
PARAMETER Junction to Case Thermal Resistance Junction to Ambient Thermal Resistance SYM. CONDITIONS A. F. R. = 1m/sec, TA = 25 C A. F. R. = 1m/sec, TA = 25 C MAX. 20 60 UNIT C/W C/W
JC JA
Note: These parameters are only applied to "TSOP" and "SOJ" package types.
AC CHARACTERISTICS
AC Test Conditions
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 3V 5 nS 1.5V CL = 30 pF, IOH/IOL = -4 mA/8 mA CONDITIONS
AC Test Loads and Waveform
R1 480 ohm R1 480 ohm 5V OUTPUT OUTPUT 30 pF
Including Jig and Scope
5V 5 pF R2 255 ohm
Including Jig and Scope
R2 255 ohm
(For TCLZ1, TCLZ2, TOLZ, TCHZ1,TCHZ2, TOHZ, TWHZ, TOW )
3.0V
90% 10% 5 nS 10%
90%
0V
5 nS
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Publication Release Date: March 1999 Revision A7
W24512A
AC Characteristics, continued (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
Read Cycle
PARAMETER SYM.
W24512A-15 MIN. MAX. W24512A-25 MIN. MAX. W24512A-25 MIN. MAX. W24512A-35 MIN. MAX.
UNIT
Read Cycle Time Address Access Time Chip Select Access Time CS1 CS2 Output Enable to Output Valid Chip Selection to Output in Low Z CS1 CS2 Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change CS1 CS2
TRC TAA TACS1 TACS2 TAOE TCLZ1* TCLZ2* TOLZ* TCHZ1* TCHZ2* TOHZ* TOH
15 3 3 0 3
15 15 15 7 7 7 7 -
20 3 3 0 3
20 20 20 10 10 10 1 -
25 3 3 0 3
25 25 25 12 12 12 12 -
35 3 3 0 3
35 35 35 17 17 17 17 -
nS nS nS nS nS nS nS nS nS nS nS nS
* These parameters are sampled but not 100% tested.
Write Cycle
PARAMETER SYM.
W24512A-15 MIN. MAX. W24512A-25 MIN. MAX. W24512A-25 MIN. MAX. W24512A-35 MIN. MAX.
UNIT
Write Cycle Time Chip Selection to End of Write CS1 CS2 Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time CS1, WE CS2 Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write
TWC TCW1 TCW2 TAW TAS TWP TWR1 TWR2 TDW TDH TWHZ* TOHZ* TOW
15 13 13 13 0 10 0 0 9 0 0
8 8 -
20 17 17 17 0 12 0 0 10 0 0
10 10 -
25 18 18 18 0 15 0 0 12 0 0
12 12 -
35 20 20 20 0 18 0 0 15 0 0
15 15 -
nS nS nS nS nS nS nS nS nS nS nS nS nS
* These parameters are sampled but not 100% tested.
-4-
W24512A
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
TRC Address TOH D OUT TAA TOH
Read Cycle 2
(Chip Select Controlled)
CS1 TACS1 CS2 TACS2 TCHZ2 TCLZ1 D OUT TCLZ2 TCHZ1
Read Cycle 3
(Output Enable Controlled)
TRC Address TAA OE TAOE TOLZ CS1 TACS1 TCLZ1 CS2 T ACS2 TCLZ2 D OUT TCHZ2 TOHZ TCHZ1 TOH
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Publication Release Date: March 1999 Revision A7
W24512A
Timing Waveforms, continued
Write Cycle 1
(OE Clock)
T WC Address TWR1 OE TCW1 CS1
CS2 TAW WE TAS TOHZ D OUT (1, 4)
TCW2 TWR2 TWP
TDW D IN
TDH
Write Cycle 2 (OE = VIL Fixed)
TWC Address TCW1 CS1 TWR1
CS2 TAW WE TAS
TCW2 TWR2 T WP TWHZ (1, 4) TOH TOW TDH (2) (3)
D OUT TDW D IN
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
-6-
W24512A
ORDERING INFORMATION
PART NO. ACCESS TIME (nS) 15 20 25 35 15 20 25 35 15 20 25 35 15 20 25 35 OPERATING CURRENT MAX. (mA) 200 160 160 140 200 160 160 140 200 160 160 140 200 160 160 140 STANDBY CURRENT MAX. (mA) 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 PACKAGE
W24512AK-15 W24512AK-20 W24512AK-25 W24512AK-35 W24512AJ-15 W24512AJ-20 W24512AJ-25 W24512AJ-35 W24512AS-15 W24512AS-20 W24512AS-25 W24512AS-35 W24512AT-15 W24512AT-20 W24512AT-25 W24512AT-35
Notes:
300 mil skinny DIP 300 mil skinny DIP 300 mil skinny DIP 300 mil skinny DIP 300 mil SOJ 300 mil SOJ 300 mil SOJ 300 mil SOJ 450 mil SOP 450 mil SOP 450 mil SOP 450 mil SOP
standard type one TSOP standard type one TSOP standard type one TSOP standard type one TSOP
1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
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Publication Release Date: March 1999 Revision A7
W24512A
PACKAGE DIMENSIONS
32-pin SOJ
32
17
Symbol A A1 A2 B
E He
Dimension in Inches
Dimension in mm
Min.
__ 0.020 0.095 0.026 0.016 0.008 0.815 0.295 0.044 0.247 0.325 0.080 __ __ 0
Nom.
__ __ 0.100 0.028 0.018 0.010 0.825 0.300 0.050 0.267 0.335 __ __ __ __
Max.
0.140 __ 0.105 0.032 0.022 0.014 0.835 0.305 0.056 0.287 0.345 __ 0.045 0.004 10
Min.
__ 0.508 2.413 0.660 0.406 0.203 20.701 7.493 1.118 6.274 8.255 2.032 __ __ 0
Nom.
__ __ 2.540 0.711 0.457 0.254 20.955 7.620 1.270 6.782 8.509 __ __ __ __
Max.
3.556 __ 2.667 0.813 0.559 0.356 21.209 7.747 1.422 7.290 8.763 __ 1.143 0.102 10
b c D E e e1
1
16
He L S Y
D
A2
A L
c
e1
S B b
e
A1
Y
Seating Plane
32-pin SO Wide Body
Symbol
32 17
Dimension in Inches
Dimension in mm
Min.
0.004 0.101 0.014 0.006
Nom.
Max.
0.118
Min.
0.10
Nom.
Max.
3.00
e1
EH
E
L Detail F
1
b
16
A A1 A2 b c D E e HE L LE S y Notes:
0.106 0.016 0.008 0.805
0.111 0.020 0.012 0.817 0.450 0.056 0.556 0.039 0.063 0.036 0.004
2.57 0.36 0.15
2.69 0.41 0.20 20.45
2.82 0.51 0.31 20.75 11.43 1.42 14.38 0.99 1.60 0.91 0.10
0.440 0.044 0.546 0.023 0.047
0.445 0.050 0.556 0.031 0.055
11.18 1.12 13.87 0.58 1.19
11.30 1.27 14.12 0.79 1.40
0
10
0
10
D
e1 c A
2
A
1
S
y
e
A
LE
1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch . and are determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec.
Seating Plane
See Detail F
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W24512A
Package Dimensions, continued
32-pin TSOP
HD
Symbol Min. Nom. Max. 0.047 0.006 0.041 0.009 0.007 Min. Nom. Max. 1.20 0.15 1.05 0.23 0.17 18.50 8.10 20.20
Dimension in Inches
Dimension in mm
D c
A A1 A2
__
0.002 0.037 0.007
__ __
0.039 0.008
__
0.05 0.95 0.17 0.12
__ __
1.00 0.20 0.15
M
e E
b c D E HD e L L1
A A2
0.005 0.006 0.720 0.311 0.780 0.724 0.315 0.787 0.020 0.020 0.031
0.10(0.004)
0.728 18.30 18.40 0.319 7.90 8.00 20.00 0.50 0.50 0.80
b
0.795 19.80
__
0.016
__
0.024
__
0.40
__
0.60
__
0.000 1
__
0.004 5
__
0.00 1
__
0.10 5
Y
__
3
__
3
L L1
A1
Y
Note:
Controlling dimension: Millimeter
32-pin P-DIP Skinny (300 mil)
Dimension in Inches
Dimension in mm
Symbol
Min. Nom. Max.
0.200 0.015 0.145 0.016 0.058 0.008 0.150 0.018 0.060 0.010 1.60 0.295 0.286 0.090 0.120 0 0.430 0.450 0.315 0.290 0.100 0.130 0.155 0.022 0.064 0.014 1.62 0.335 0.294 0.110 0.140 15 0.470 0.065
Min. Nom. Max.
5.08 0.38 3.68 0.41 1.47 0.20 3.81 0.46 1.52 0.25 40.64 7.49 7.26 2.29 3.05 0 10.92 11.43 8.00 7.36 2.54 3.30 3.94 0.56 1.63 0.36 41.15 8.50 7.46 2.79 3.56 15 11.94 1.65
D
32 17
E1
1
16
A A1 A2 B B1 c D E E1 e1 L
a
eA S
Notes:
S E
Base Plane
A A2 L A1
c
Mounting Plane
B1 B e1 a eA
1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimension D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec.
-9-
Publication Release Date: March 1999 Revision A7
W24512A
VERSION HISTORY
VERSION A7 DATE Mar. 1999 PAGE DESCRIPTION Arrange access time for 15/20/25/35 nS
Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064
Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab.
2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
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